| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealant composition for underfill capable of being simply solubilized. SOLUTION: The sealant composition for underfill [1] comprises an epoxy compound having at least two epoxy groups in the molecule, a curing catalyst or a compound which forms the curing catalyst when heated, and particles which, when heated, release a compound capable of inactivating the curing catalyst, the particles having a particle diameter larger than the gap between a wiring board and a chip component. A method [2] for semiconductor packaging is also provided which comprises applying the composition [1] to a substrate to which the chip component is bonded through a bump electrode made of solder, filling the composition [1] into the gap between the chip component and the substrate, curing the composition [1] in the gap by heating, and removing that part of the composition [1] which is situated at the outside of the gap. COPYRIGHT: (C)2005,JPO&NCIPI
|
