发明名称 TEMPERATURE CONTROL APPARATUS, ELECTRONIC COMPONENT HANDLER, AND METHOD FOR CONTROLLING TEMPERATURE OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for controlling the temperature of electronic components and excellent in responsiveness and accuracy through the use of water. SOLUTION: The temperature control apparatus is provided with a hollow heat-exchange block assembly 10 which is in contact with a device to be inspected 50 for transferring heat to each other and in which an opening part 11A is formed in a part of a contact region with the device to be inspected 50 for making the inside and outside of the heat-exchange block assembly 10 communicate with each other; a fluid supply source 20 connected to a hollow part 12 of the heat-exchange block assembly 10 via a first channel 21 and capable of supplying at least a liquid for cooling; a control valve 22 for adjusting the quantity of fluid supplied for the hollow part 12 from the fluid supply source 20; a vacuum source 30 connected to the hollow part 12 of the heat-exchange block assembly 10 via a second channel 31 for vacuuming the hollow part 12; and a controller 40 capable of controlling at least either the quantity of flow of the control valve 22 or the vacuuming degree of the vacuum source 30. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006343174(A) 申请公布日期 2006.12.21
申请号 JP20050167872 申请日期 2005.06.08
申请人 SEIKO EPSON CORP 发明人 SHIMOJIMA SOKO
分类号 G01R31/26 主分类号 G01R31/26
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