| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor apparatus wherein the influence of the breakage is reduced in the peeling stage. SOLUTION: After circuit blocks (composite units of thin film semiconductor devices formed for each function) are formed, they are arranged on a flexible substrate, and each circuit block is electrically connected. The circuit blocks are also laminated (a laminated structure). The above-mentioned structure improves the yield of this semiconductor apparatus and reduces the manufacturing cost thereof. The semiconductor apparatus is thereby miniaturized. COPYRIGHT: (C)2008,JPO&INPIT
|
