发明名称 GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH INITIAL BONDABILITY, HIGH BONDING RELIABILITY, HIGH ROUNDNESS OF COMPRESSION BALL, HIGH STRAIGHTNESS, AND HIGH RESIN FLOWABILITY RESISTANCE
摘要 There is provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire comprises one kind or two kinds of Pt and Pd of 1000 to less than 5000 ppm in total, Ir: 1 to 200 ppm, Ca: 20 to 100 ppm, Eu: 10 to 100 ppm, Be: 0.1 to 20 ppm, if necessary, and La: 10 to 100 ppm, if necessary. The total amount of at least two kinds of Ca, Eu, Be, and La is in a range of 50 to 250 ppm.
申请公布号 US2009101695(A1) 申请公布日期 2009.04.23
申请号 US20060917233 申请日期 2006.06.08
申请人 TANAKA DENSHI KOGYO K.K. 发明人 MAKI KAZUNARI;NAKATA YUJI
分类号 B23K35/14 主分类号 B23K35/14
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