发明名称 Method of forming electric wiring using inkjet printing
摘要 Disclosed is a method of forming an electric wiring using inkjet printing. The method includes forming a main trench and first and second guide trenches on a substrate. The first and second guide trenches are disposed at opposite sides of the main trench. The method includes ejecting ink into the main trench, the ink including a conductive material. The method also includes heating the substrate to sinter the ink such that the electric wiring is formed an upper portion of the main trench, and contract the ink such that a tunnel is formed in a lower portion of the main trench.
申请公布号 US9386708(B2) 申请公布日期 2016.07.05
申请号 US201313861754 申请日期 2013.04.12
申请人 Samsung Electronics Co., Ltd. 发明人 Kim Joong-hyuk;Jin Yong-wan;Hong Young-ki;Kang Sung-gyu;Lee Seung-ho;Hong Jin-seok
分类号 H05K3/10;H05K3/12;C23C22/83;C23C22/78 主分类号 H05K3/10
代理机构 Harness, Dickey & Pierce, P.L.C. 代理人 Harness, Dickey & Pierce, P.L.C.
主权项 1. A method of forming an electric wiring, the method comprising: forming a main trench and first and second guide trenches on a substrate, the first and second guide trenches being disposed at opposite sides of the main trench; performing an ink-phobic surface treatment with respect to a surface of the substrate by coating fluorine on the surface of the substrate after forming the main trench and the first and second guide trenches; ejecting ink into the main trench to fill the main trench with the ink, the ink including a conductive material and a solvent; and sintering the ink filled in the main trench to form the electric wiring formed of the conductive material in an upper portion of the main trench and form a tunnel in a lower portion of the main trench, wherein the ejecting the ink includes ejecting ink so as to contact an upper surface of a first portion of the substrate between the main trench and the first guide trench and to contact an upper surface of a second portion of the substrate between the main trench and the second guide trench, and wherein the forming the main trench and the forming the first and second guide trenches includes forming each trench such that a sum of a width of the upper surface of the first portion of the substrate and a width of the upper surface of the second portion of the substrate is greater than a width of a bottom surface of the main trench, and wherein during the sintering of the ink, the ink filled in the lower portion of the main trench moves up by contraction of the ink due to evaporation of the solvent so that the ink substantially separates from the bottom surface of the main trench and the tunnel is formed in the lower portion of the main trench.
地址 Gyeonggi-Do KR