发明名称 METHOD OF MANUFACTURING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component that can form a resist cured body layer with a high reflective index to light by using white pigment and also enhance resolution, undercut preventiveness and migration resistance of the resist cured body layer.SOLUTION: A method of manufacturing an electronic component according to the present invention comprises: a first step of using a non-development type photocurable composition which includes a photocurable compound, a photopolymerization initiator, and white pigment, can be cured by irradiation with light, and can form a resist cured body layer so as to form a plurality of resist layers in a patterned state on a surface of an electronic component body without exposure; and a second step of curing the plurality of resist layers by irradiating the plurality of resist layers with light so as to form a plurality of resist cured body layers.SELECTED DRAWING: Figure 1
申请公布号 JP2016152410(A) 申请公布日期 2016.08.22
申请号 JP20150031120 申请日期 2015.02.19
申请人 SEKISUI CHEM CO LTD 发明人 KIN CHIZURU
分类号 H05K3/28 主分类号 H05K3/28
代理机构 代理人
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