| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state image pickup device which is manufactured by forming a dam of a sealing material at the peripheral edge portion of a sensor face of a CSP type sensor chip and adhesively attaching cover glass to the dam and in which occurrence of bubbles from the dam can be prevented and the width of the dam can be controlled, and a manufacturing method for the solid-state image pickup device.SOLUTION: In a solid-state image pickup device manufactured by forming a dam as a partition wall over the whole periphery of the peripheral edge portion of a sensor face of a CSP type sensor chip and adhesively attaching cover glass to the dam, the dam is configured to contain at least doubled portion having a width at which no bubble occurs at the adhesive portion after the dam is adhesively attached to the cover glass.SELECTED DRAWING: Figure 1 |
