SEMICONDUCTOR LASER DEVICE, ITS MANUFACTURING METHOD, AND PICKUP USING THIS SEMICONDUCTOR LASER DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an inexpensively manufactured semiconductor laser device wherein attaching accuracy is high and soldering is easy, its manufacturing method, and a pickup using the semiconductor laser device.

SOLUTION: A lead extended in the longitudinal direction of a package formed by molding an insulating resin in a lead frame is bent toward the backside of the package. The lead is formed into a pattern in which an outer lead part is larger in space than an inner lead part and the lead is widened from the midway of the outer lead. The attaching reference surface of the package is set as the largest outer shape of the package.

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