IMPROVEMENTS IN OR RELATING TO SOLDERS.

摘要

A substantially lead-free solder with enhanced properties comprises from 88.5 % to 93.5 % tin; from 3.5 % to 4.5 % silver; from 2.0 % to 6.0 % indium; and from 0.3 % to 1.0 % copper. The solder may also comprise up to 0.5 % of an anti-oxidant or anti-skinning additive. A solder embodying the invention finds particular utility in wave-soldering processes where it may be used as a direct replacement for conventional tin/lead solder.