发明名称 |
Semiconductor testing device |
摘要 |
A wafer testing device in which a plurality of wafers can be tested simultaneously significantly reducing the time required for testing each chip. A prober is provided which receives a wafer to be tested. A probe card is coupled to the prober having a window through which a plurality of semiconductor memory chips on the wafer are observable. A plurality of probes are coupled to the periphery of the window in such a manner that the probes can be brought into contact with bonding pads on the plurality of semiconductor memory chips. A tester is connected to the probes which is capable of simultaneously testing each of the plurality of chips.
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申请公布号 |
US4799009(A) |
申请公布日期 |
1989.01.17 |
申请号 |
US19830479117 |
申请日期 |
1983.03.31 |
申请人 |
VLSI TECHNOLOGY RESEARCH ASSOCIATION |
发明人 |
TADA, TETSUO;OKADA, KEISUKE |
分类号 |
G01R31/26;G01R1/073;G01R31/28;H01L21/66;(IPC1-7):G01R1/06;G01R31/02 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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