Semiconductor memory device with stacked capacitor above bit lines

摘要

After a word line is formed on a semiconductor substrate, a side-wall insulating film is formed on the side faces of the word line. Subsequently, a first insulating film is deposited thereon. The resulting first insulating film is formed with an opening for a bit line, through which a bit line having an on-bit-line insulating film on its top surface is formed. Thereafter, a second insulating film is deposited thereon. An opening for a charge-storage electrode is then formed in the first and second insulating film by removing, by a specified thickness, the portions of the first insulating film, on-bit-line insulating film, and second insulating film lying in a memory cell array region, followed by the deposition of a charge-storage electrode through the opening for a charge-storage electrode.