发明名称 ADHESIVE SETTING METHOD OF PART AND DEVICE THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide an adhesive setting method for parts and a device therefor through using a photosensitive adhesive, capable of improving bonding accuracy, bonding reliability and yield by optimally pressing parts with neither such overpressing as to apply an impact on the parts nor such underpressing as to set the parts afloat to accomplish mutual adhesive setting of the parts in extremely high accuracy. SOLUTION: In this adhesive setting device designed to mutually bond and set a pair of parts M and N via a photosensitive adhesive, there are equipped a pressing mechanism 14 to mechanically press via the adhesive S and tentatively position a pair of parts as objects, a means having an optodistorting element 13 and to apply additional pressing force to the pressing force by the pressing mechanism owing to the distortion given by the optodistorting element, and an ultraviolet light irradiation source 30 to accomplish adhesive setting of the pair of parts by irradiating both the photosensitive adhesive and the optodistorting element with ultraviolet light.
申请公布号 JPH0959571(A) 申请公布日期 1997.03.04
申请号 JP19950219009 申请日期 1995.08.28
申请人 TOSHIBA CORP 发明人 MURAI SEIICHIRO
分类号 G02B7/00;B29C65/48;B29L11/00;C09J5/00;(IPC1-7):C09J5/00 主分类号 G02B7/00
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