| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject apparatus having low stress characteristics and reliability on water vapor resistance, excellent in moldability and sealing of semiconductor elements by using an epoxy resin composition containing an epoxy resin, a phenol resin, an amine-modified silicone oil and butadiene- based rubber particles. SOLUTION: This semiconductor apparatus is obtained by using an epoxy resin composition containing (A) an epoxy resin (e.g. cresol novolak type, phenol novolak type, etc.), (B) a phenol resin (e.g. phenol novolak, cresol novolak, etc.), as a curing agent, (C) an amine-modified silicone oil e.g. an amine- modified silicone oil expressed by the formula [R1 and R2 are each a monovalent amino-modified alkyl; (n) is 0-40]}, (D) butadiene-based rubber particles (e.g. a methyl methacrylate-butadiene-styrene copolymer, etc.), and preferably (E) a mercapto-based silane coupling agent. |
