发明名称 Herstellungsverfahren eines Leiterrahmens
摘要 In a method for manufacturing a lead frame, a pre-determined pattern is formed on a matrix (10) by a resist (12), an electro-deposition portion (13) is provided in a cavity formed in the resist patterns (12) and the electro-deposition pattern (13) is separated from the matrix (10). The resist pattern is formed on the matrix (10) so that a cavity portion (17) connecting a plurality of cavity (16) ends for inner lead formation can be included in the resist pattern, and an electro-deposition portion is provided into the cavity portion (17) so that the electro-deposition pattern (13) can be formed into a configuration in which the tip ends of inner leads (22) are connected by a connecting piece (21), and the electro-deposition pattern (13) is separated from the matrix (10) while the tip ends of the inner leads (22) are connected by the connecting piece (21). Alternatively the tip ends are connected by a fixing member such as an adhesive tape. The electro-deposited material (13) may be plated whilst still held by the matrix (10) to reduce distortion. A connection between the leads may also be formed as a dam bar which again provides mutual support during lead frame processing. Various parts of the lead frame may be made thicker by selectively applying multi-layer plating. At least one of the multi-layers may be a reinforcing layer. <IMAGE>
申请公布号 DE69323978(T2) 申请公布日期 1999.08.26
申请号 DE1993623978T 申请日期 1993.12.22
申请人 SHINKO ELECTRIC INDUSTRIES CO. LTD. 发明人 FUKASE, KATSUYA;IIJIMA, TAKAHIRO;NAKAZAWA, MASAO;WAKABAYASHI, SHINICHI
分类号 H01L23/50;H01L21/48;H01L23/495;H05K3/20;H05K3/34 主分类号 H01L23/50
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