SUPER BGA SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A super BGA(ball grid array) package is provided to facilitate circuit action performance test and reliability test by increasing the circuit board size larger than heat sink size and supplying a test pattern part. CONSTITUTION: The super BGA package array(10) comprises a PCB(printed circuit board)(S) equipped with a heat sink(HS), a circuit pattern on the PCB(S) and a ball(B) at the bottom of the PCB(S). An extension part(20) is formed by protruding the PCB(S) more than the heat sink(HS). A test pattern part(30) formed on the extension part(20) is connected with the circuit pattern on the PCB(S). A terminal(31) is equipped on the test pattern part(30) that is connected with a circuit testing probe.