发明名称 METHOD AND DEVICE FOR MANUFACTURING LAMINATED ELECTRONIC COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a method and device for manufacturing laminated electronic components by which the manufacturing efficiency of laminated electronic parts can be improved. SOLUTION: In the manufacturing method, green sheets 10 are supplied alternately to first and second holding tables 20 and 30 from a supply base 1, and conductive paste is printed on the green sheets 10 held on the first table 20 by means of a first printing device 40, and on the green sheets 10 held on the second table 30 in a pattern which is different from that of the first printing device 40 by means of a second printing device 50. The green sheets 10, respectively carrying the conductive paste printed by means of the printing devices 40 and 50, are transported alternately on a conveyance belt 60, and after drying by means of a drier 70, they are housed in a housing base 2 or 3 corresponding to the printing devices 40 and 50.</p>
申请公布号 JP2001326135(A) 申请公布日期 2001.11.22
申请号 JP20000143873 申请日期 2000.05.16
申请人 TAIYO YUDEN CO LTD 发明人 SEKIGUCHI YOSHIJI;ANDO KOICHI;KOIZUMI KATSUO
分类号 B41F15/08;B28B11/04;B41F15/12;B41F15/20;B41F15/26;H01G4/12;H01G4/30;H01G4/33;H01G13/00;H05K3/46;(IPC1-7):H01G4/12 主分类号 B41F15/08
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