发明名称 |
POLISHING METHOD, POLISHING DEVICE, AND SEMICONDUCTOR DEVICE PRODUCING METHOD |
摘要 |
A wafer (30) is polished by relatively moving a polishing body and the wafer (30) while applying a load between the polishing body and the wafer (30), with a polishing agent interposed between the polishing body and the wafer (30). A first step polishes the wafer (30) by using a hard polishing pad (42) as the polishing body while pressing the wafer (30) against the polishing pad (42) by air pressure. A second step following the first step uses a soft polishing pad as the polishing body to polish the wafer (30). This reduces erosion, dishing, etc., and provides a polished surface having few microscratches, further improving the flatness. |
申请公布号 |
WO02056356(A1) |
申请公布日期 |
2002.07.18 |
申请号 |
WO2002JP00009 |
申请日期 |
2002.01.07 |
申请人 |
NIKON CORPORATION;MATHUKAWA, EIJI |
发明人 |
MATHUKAWA, EIJI |
分类号 |
B24B37/013;B24B37/04;B24B37/20;B24B37/24;B24B37/26;B24B57/02;H01L21/304;H01L21/321;(IPC1-7):H01L21/304;B24B37/00 |
主分类号 |
B24B37/013 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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