MANUFACTURING METHOD OF HYBRID ELECTRONIC CIRCUITS FOR BUILD-IN TYPE MEDICAL EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of two or more hybrid electronic circuits for build-in type medical equipment, and circuits manufactured using such method. SOLUTION: This method includes the following processes: a) The flat cluster type plate substrate which has the pattern of a contact area for chips on a first surface and the pattern of a metalization area for components constituted by the same repeat patterns corresponding to two or more circuits manufactured on a second surface (rear) is established. b) Two or more chips are bonded on the first surface. c) The chips are connected to an appropriate contact area. d) An uniform coating resin layer is formed by injecting a coating resin into the first surface. e) The resin is hardened. f) The plate is cut and individual substrates form several different substrates possessing the chips coated on the first surface and each one of these substrates corresponds to the individual circuits of the build-in type equipment. g) This equipment is completed by mounting the SMC element and/or the connector element on the second surface of each individual substrate.