发明名称 THIN WIRE CHIP MATERIAL
摘要 <P>PROBLEM TO BE SOLVED: To provide a thin wire chip material from which a fine metal ball of high quality can be manufactured at a low cost. <P>SOLUTION: The problem mentioned above is disolved by the thin wire chip material composed of, at least, two thin wires which are twined. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004363189(A) 申请公布日期 2004.12.24
申请号 JP20030157077 申请日期 2003.06.02
申请人 HITACHI METALS LTD 发明人 NISHI YUICHI;MIKAMOTO TSUKASA
分类号 H01L21/60 主分类号 H01L21/60
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