LOW TEMPERATURE CO-FIRED CERAMIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

An LTCC(Low Temperature Co-fired Ceramic) package and a method for manufacturing the same are provided to reduce a process time and a process cost by minimizing a rising level of temperature and improving heat radiation in a manufacturing process. An LTCC substrate(120) includes a plurality of LTCC layers and a recess. An element is mounted on the recess of the LTCC substrate. A thermal conducting element(140) is attached on the first LTCC layer exposed through the recess by using a first thermal conducting adhesion member. An element(110) is attached to an upper surface of the thermal conducting element by using a second thermal conducting adhesion member. A connective member is formed to connect electrically the element and the LTCC substrate to each other. The thermal conducting element includes a lower thermal conducting element attached to the first LTCC layer and an upper thermal conducting element positioned on an upper surface of the lower thermal conducting element.