SCANNER HAVING WAFER STAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

摘要

The method of forming the semiconductor device and the scanner are provided to prevent pattern defects generated in the contamination of the wafer backside by fixing the wafer side part by using the wafer guide. The wafer(8) is settled on the top of the chuck(4) of the wafer stage(2). In this case, the wafer reaches the lift pin of the upper part of chuck by rise of the lift pin installed through the chuck. The lift pin descends to the set-up height in advance. The wafer guide(6) moves to the middle direction of chuck and it contacts in the edge of wafer and fixes wafer. The lift pin more descends and it is separated from the wafer. The wafer is spaced from the chuck and is fixed with the wafer guide. The chuck of the stage uses the wafer guide and the chuck is fixed to the side of wafer.