| 摘要 |
A light emitting device is provided. The light emitting device comprises a substrate, a first lead frame and a second lead frame on the substrate, a first light emitting diode, a heat conductor on the substrate, and a heat transfer pad. The first light emitting diode on the first lead frame is electrically connected to the first lead frame and the second lead frame. The heat conductor is electrically separated from the first lead frame. The heat transfer pad contacts the first lead frame and the heat conductor thermally to connect the first lead frame to the heat conductor. |
