发明名称 |
CONDUCTIVE PASTE |
摘要 |
There is provided a photosetting conductive paste that has a surface resistance of no greater than 200 m.OMEGA./sq. upon curing by light irradiation. The photosetting conductive paste comprises conductive powder and a photosetting resin composition in specific amounts. The conductive powder contains dendritic conductive powder and scaly conductive powder at 80% or greater of the total conductive powder, the dendritic conductive powder having a mean particle size of 0.05-1.0 .mu.m, a specific surface area of 0.5-5.0 m2/g, and the scaly conductive powder having a mean particle size of 1.0-10.0 .mu.m and a specific surface area of 0.5-5.0 m2/g, wherein the weight ratio of the dendritic conductive powder and scaly conductive powder is 6/40 - 95/5. There is also provided a method of forming an antenna for a radio frequency identification medium that comprises printing the conductive paste on a substrate in an antenna-shaped pattern and curing it.
|
申请公布号 |
CA2284978(C) |
申请公布日期 |
2009.06.16 |
申请号 |
CA19992284978 |
申请日期 |
1999.09.29 |
申请人 |
TOPPAN FORMS CO., LTD. |
发明人 |
ENDO, YASUHIRO;KODAMA, KAZUNARI;KAGAMI, YASUO;MARUYAMA, TORU |
分类号 |
H01B1/20;H01B5/16;G06K19/077;H01Q1/38;H05K1/09;H05K3/12;H05K3/46 |
主分类号 |
H01B1/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|