| 摘要 |
The present invention relates to a cap mounting method and a cap mounting apparatus for semiconductor element packages. At the time of mounting caps on semiconductor element packages, a plurality of caps (6) are disposed in the x direction at a disposition pitch corresponding to the disposition pitch of a plurality of semiconductor element packages (3), the disposed caps (6) are sucked at one time by tilting the caps with respect to the horizontal direction, and the sucked caps (6) are inserted into cap mounting recessed sections (31) of the corresponding semiconductor element packages (3) at one time, while keeping the tilted state. |
