发明名称 EPOXY RESIN COMPOSITION AS WELL AS PREPREG AND LAMINATED PLATE USING SAME
摘要 Provided are an epoxy resin composition as well as a prepreg and a laminated plate using same. The epoxy resin composition comprises: phenol formaldehyde epoxy resin; core-shell rubber toughened epoxy resin and/or core-shell rubber; bromide bisphenol A-type epoxy resin: tetrafunctional epoxy resin: active ester and linear phenol formaldehyde resin composite curing agent. The prepreg and the laminated plate formed by using the epoxy resin composition have good thermal resistance, low dielectric loss, good humidity resistance, low water absorption and good toughness.
申请公布号 WO2016101497(A1) 申请公布日期 2016.06.30
申请号 WO2015CN78781 申请日期 2015.05.12
申请人 SHENGYI TECHNOLOGY CO., LTD. 发明人 HE, LIEXIANG;ZENG, XIANPING
分类号 C08L63/00;B32B15/092;B32B25/02;C08G59/62;C08L63/04 主分类号 C08L63/00
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