APPARATUS AND METHOD FOR TREATING SUBSTRATE, AND DISCHARGE RATE MEASURING UNIT

摘要

The present invention relates to a substrate treatment apparatus. According to one embodiment of the present invention, the substrate treatment apparatus comprises: a support unit supporting a substrate; a nozzle unit having one or more heads injecting treatment solution to the substrate supported by the support unit; and a discharge amount measurement unit measuring a discharged amount of the treatment solution discharged from the nozzle. The discharge amount measurement unit can comprise: a stage providing a space where the discharge amount of the treatment solution is measured; a roller member supplying a test film to and recovering the test film from the stage, wherein the test film is to measure the discharge amount; and a suction member sucking the treatment solution discharged on the test film.