发明名称 PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To improve the precision of a fingerprint recognition.SOLUTION: A printed wiring board of an embodiment comprises: an insulation layer having a first face and a second face on the opposite side of the first face; a first conductor circuit for a fingerprint authentication on the first face of the insulation layer; a second conductor circuit for a fingerprint authentication on the second face of the insulation layer; and a solder resist layer on the first face of the insulation layer and on an upper side on the first conductor circuit. Moreover, the dielectric constant of the solder resist layer on the upper side is higher than the dielectric constant of the insulation layer.SELECTED DRAWING: Figure 1
申请公布号 JP2016150133(A) 申请公布日期 2016.08.22
申请号 JP20150029407 申请日期 2015.02.18
申请人 IBIDEN CO LTD 发明人 INAGAKI YASUSHI;FURUYA TOSHIKI;FURUTA TORU;OONAGANE OSAMU
分类号 A61B5/117;G01B7/28;G06F3/044;H05K1/16;H05K3/46 主分类号 A61B5/117
代理机构 代理人
主权项
地址