发明名称 MEMS DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a MEMS device in which the operation space of an operation element is sealed so as to be able to keep a desired vacuum, by bonding an element wafer in which an operation element, such as a MEMS vibrator, is formed and a sealing wafer having a through electrode.SOLUTION: A MEMS device has an element wafer 1 including a recess (operation space) 120 housing an operation element such as a MEMS vibrator 2, and a sealing wafer 5 being bonded to the element wafer 1 so as to become a lid body forming the operation space by sealing the recess. The sealing wafer 5 has a through electrode 6 for connection with a connection electrode 7 of the element wafer 1 by exposing one end to a surface bonded to the element wafer 1. The sealing wafer 5 seals the operation space 120 after high temperature degassing by normal temperature bonding to the element wafer 1 in a vacuum atmosphere, and one end of the through electrode 6 at the time of normal temperature bonding after high temperature degassing is flush with a surface on which the sealing wafer 5 is bonded to the element wafer 1.SELECTED DRAWING: Figure 2
申请公布号 JP2016171393(A) 申请公布日期 2016.09.23
申请号 JP20150048503 申请日期 2015.03.11
申请人 NIPPON DEMPA KOGYO CO LTD 发明人 TASHIRO AKIHIKO
分类号 H03H9/24;B81B3/00;B81C3/00;H03H3/007 主分类号 H03H9/24
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