Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

摘要

A method of manufacturing a semiconductor device includes performing a cycle a predetermined number of times, the cycle including supplying a first precursor containing a specific element and a halogen group to form a first layer and supplying a second precursor containing the specific element and an amino group to modify the first layer into a second layer. A temperature of the substrate is set such that a ligand containing the amino group is separated from the specific element in the second precursor, the separated ligand reacts with the halogen group in the first layer to remove the halogen group from the first layer, the separated ligand is prevented from being bonded to the specific element in the first layer, and the specific element from which the ligand is separated in the second precursor is bonded to the specific element in the first layer.

主权项

1. A method of manufacturing a semiconductor device, comprising:
(i) performing a cycle a predetermined number of times to form a thin film on a substrate, the thin film consisting of a specific element, the cycle comprising:
supplying a first precursor containing the specific element and a halogen group to the substrate to form a first layer containing the specific element and the halogen group; andsupplying a second precursor containing the specific element and an amino group to the substrate to modify the first layer to form a second layer, the second precursor containing one amino group in each molecule of the second precursor; and (ii) supplying a third precursor containing the specific element and inorganic material and containing no halogen group to the substrate to form a third layer containing the specific element, wherein in the act of performing the cycle the predetermined number of times, a temperature of the substrate is set within a range of 300 to 450 degrees C. such that a ligand containing the amino group is separated from the specific element in the second precursor, the separated ligand reacts with the halogen group in the first layer to remove the halogen group from the first layer, the separated ligand is prevented from being bonded to the specific element in the first layer, and the specific element from which the ligand is separated in the second precursor is bonded to the specific element in the first layer.