发明名称 THERMOSETTING RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin composition in which a film after calcination has excellent water resistance, and a film after main firing is excellent in flatness, heat resistance, adhesiveness to a ground substrate such as glass, and transparency.SOLUTION: There is provided a resin composition which contains polyester amide acid obtained by reaction of a compound containing tetracarboxylic acid dianhydride, diamine and a polyhydric hydroxy compound, an epoxy resin containing 3 to 20 epoxy groups per one molecule and having a weight average molecular weight of less than 5,000, and a vinyl group-containing compound, by a specific amount, respectively.SELECTED DRAWING: None
申请公布号 JP2016183258(A) 申请公布日期 2016.10.20
申请号 JP20150064265 申请日期 2015.03.26
申请人 JNC CORP 发明人 OKAMOTO YUKI;KONDO MANABU
分类号 C08G59/42;C08G59/20;C08G73/10 主分类号 C08G59/42
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