发明名称 レーザ加工方法
摘要 There is obtained a laser processing method by which an excellent shape of a cut surface can be achieved and an increase in cost can be suppressed. A laser processing method according to the present invention includes the steps of: preparing a material to be processed (S10); and forming a modified area in the material to be processed, by irradiating the material to be processed with laser beam (S20). In the aforementioned step (S20), pulsed laser beam having a continuous spectrum is focused with a lens, thereby forming a focusing line constituted by a plurality of focuses that are obtained by predetermined bands forming the continuous spectrum of the laser beam, and the material to be processed is irradiated with the laser beam such that at least a part of the focusing line is located on a surface of the material to be processed, thereby forming the modified area on an axis of the focusing line.
申请公布号 JP6020983(B2) 申请公布日期 2016.11.02
申请号 JP20120026244 申请日期 2012.02.09
申请人 住友電気工業株式会社;国立大学法人 岡山大学 发明人 角井 素貴;耕田 浩;金内 靖臣;玉置 忍;長能 重博;宇野 義幸;岡本 康寛;高橋 健太
分类号 B23K26/53;B23K26/00;B23K26/046;B23K26/40;B28D5/00;H01L21/301 主分类号 B23K26/53
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