| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing tape-integrated film for a semiconductor back surface, usable from a dicing process of a semiconductor wafer to a flip-chip bonding process of a semiconductor chip.SOLUTION: A dicing tape-integrated film for a semiconductor back surface includes: a dicing tape comprising an adhesive layer on a base material; and a flip chip type film for a semiconductor back surface provided on the adhesive layer. In the dicing tape-integrated film for a semiconductor back surface, the peeling force (temperature: 23°C, peeling angle: 180°, tensile rate: 300 mm/min) between the adhesive layer of a dicing tape and the flip chip type film for a semiconductor back surface is 0.05-1.5 N/20 mm, the light transmittance of the flip chip type film for a semiconductor back surface is 20% or less, and the flip chip type film for a semiconductor back surface is colored.SELECTED DRAWING: Figure 1 |
