| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flip chip packaging method which can connect an electrode and metal particulate with high reliability without needing high heating and pressurization even if oxide and contamination exist on the surface of the electrode. <P>SOLUTION: Metal paste 20 wherein the metal particulate 21 whose mean particle diameter is 1-100 nm is distributed in solvent 22 is supplied on the electrode 2 of a substrate 1. The electrode 11 of a chip 10 and the electrode 2 of the substrate 1 are aligned interposing the metal paste 20, ultrasonic vibration U is impressed to at least one of a chip side and a substrate side, and the surface of the electrode at an interface with the metal paste 20 is activated. After that, heating is performed at a temperature which is at least boiling point of the solvent 22 which constitutes the metal paste 20 and at most melting point of the metal particulate 21, the solvent 22 is evaporated, and metal bonding of the electrode 11 of the chip 10 and the electrode 2 of the substrate 1 is performed through a metal sintered body 23. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
