发明名称 |
Systems and methods for characterizing a polishing process |
摘要 |
Systems and methods for characterizing a polishing process are provided. One method includes scanning a specimen with two or more measurement devices during polishing. In one embodiment, the two or more measurement devices may include a reflectometer and a capacitance probe. In another embodiment, the two or more measurement devices may include an optical device and an eddy current device. An additional embodiment relates to a measurement device for scanning a specimen during polishing. The device includes a light source and a scanning assembly. The scanning assembly is configured to scan light from the light source across the specimen during polishing. Another measurement device includes a laser light source coupled to a first fiber optic bundle and a detector coupled to a second fiber optic bundle. An additional method includes scanning a specimen with different measurement devices during different steps of a polishing process.
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申请公布号 |
US6884146(B2) |
申请公布日期 |
2005.04.26 |
申请号 |
US20030358105 |
申请日期 |
2003.02.04 |
申请人 |
KLA-TENCOR TECHNOLOGIES CORP. |
发明人 |
LEHMAN KURT;CHEN CHARLES;ALLEN RONALD L.;SHINAGAWA ROBERT;SETHURAMAN ANANTHA;BEVIS CHRISTOPHER F.;TRIKAS THANASSIS;CHEN HAIGUANG;MENG CHING LING |
分类号 |
B24B37/04;B24B41/04;B24B49/04;B24B49/10;B24B49/12;(IPC1-7):B24D49/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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