| 摘要 |
PURPOSE:To lower the loop level of the bonding wires connecting inner leads to a semiconductor chip for avoiding the deformation of the semiconductor chip by a method wherein the wiring layer on a insulating tape passing through the part between the inner leads and electrode pads is formed of a thin conductive film. CONSTITUTION:The title semiconductor device has a LOC structure and end parts of respective inner leads 13 are fixed to the main surface of a semiconductor chip 1 by insulating tapes 24. At this time, conductive films 25 are exposed in the regions near the electrode pads 12 whereto respective inner leads 13 are not fixed. Respective inner leads 13 different from the power supply pins and the electrode pads 12 of the semiconductor chip 11 are connected to one another in no contact with the conductive film 25 e.g. by bonding wires 26. Besides, the electrode pads 12 corresponding to power supply pads among the electrode pads 12 of the semiconductor chip 11 and the conductive film 25 are connected by the other bonding wires 27. Furthermore, the conductive films 25 are connected to the leads 13 corresponding to the power supply pins among respective inner leads 13 by the other bonding wires 28. |
