发明名称 Three-dimensional device layout with sub-groundrule features
摘要 Method for forming three-dimensional device structures comprising a second device having sub-groundrule features formed over a first device is disclosed. A layer having a single crystalline top surface is formed above the first device to provide the base for forming the active area of the second device. the sub-groundrule feature is formed using mandrel and spacers.
申请公布号 US5893735(A) 申请公布日期 1999.04.13
申请号 US19960742533 申请日期 1996.11.01
申请人 SIEMENS AKTIENGESELLSCHAFT;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 STENGL, REINHARD J.;HAMMERL, ERWIN;MANDELMAN, JACK A.;HO, HERBERT L.;SRINIVASAN, RADHIKA;SHORT, ALVIN P.;POSCHENRIEDER, BERNHARD
分类号 H01L21/8242;H01L27/108;(IPC1-7):H01L21/824 主分类号 H01L21/8242
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