发明名称 |
Method of manufacturing sheet material and method of manufacturing circuit device using the same |
摘要 |
The invention is to form plated films on a conductive foil a thigh precision, and simplify a procedure of forming the plated film. A resin film composed of a thermosetting resin is formed on the surface of the conductive foil. The resin film of parts which become bonding pads and die pads is eliminated by a laser etching. A clamper presses of the periphery of the block so as to form hermetically sealed spaces on the block. The interior of the clamper is filled with a plating liquid by means of an injection means and an evacuation means, and subsequently, and Ag plated film is formed by an electroplating method.
|
申请公布号 |
US6889428(B2) |
申请公布日期 |
2005.05.10 |
申请号 |
US20030617339 |
申请日期 |
2003.07.10 |
申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
IGARASHI YUSUKE;SAKAMOTO NORIAKI;NAKAMURA TAKESHI;KOBAYASHI YOSHIYUKI |
分类号 |
C25D5/02;C25D7/00;H01L21/48;H01L23/31;H01L23/495;H01L23/50;H01L25/04;H01L25/18;(IPC1-7):H05K3/30 |
主分类号 |
C25D5/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|