METHOD FOR SUPPLYING SOLDER AND METHOD AND DEVICE FOR FORMING SOLDER BUMP USING IT

摘要

PROBLEM TO BE SOLVED: To equalize the supply quantity of solder corpuscles supplied at different places in a substrate. SOLUTION: The substrate 20 is positioned in liquid 13 in a liquid tank 11 so that a surface is directed upward. The inside of the liquid 13 is supplied with a solder corpuscle group 14 from a plate 40, and solder corpuscles 14a are precipitated on the substrate 20. The solder corpuscles 14a precipitate and reach the substrate 20. The solder corpuscles 14a reaching the upper section of a pad electrode for the substrate 20 stay on the upper section of the pad electrode by gravity, and spread on the surface of the pad electrode and a solder film is formed when a solder wetting time passes. COPYRIGHT: (C)2005,JPO&NCIPI