| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer circuit board including a step of reliably forming a rough surface in a roughing process. SOLUTION: The method of manufacturing a multilayer circuit board in a buildup process comprises a step of thermosetting a resin coat layer formed by coating the surface of a lower circuit board 1 with an epoxy resin to convert the resin coat layer to a hardened insulation layer 2' for an upper circuit board. This step comprises a step of half-hardening the resin coat layer 2 held at a temperature of 120°C for 10-20 minutes after heating the just formed resin coat layer 2 from a temperature of 90°C to the temperature of 120°C for 20-40 minutes. COPYRIGHT: (C)2005,JPO&NCIPI |
