METHODS OF FORMING SOLDER CONNECTIONS AND STRUCTURE THEREOF

摘要

A method for forming solder connections using dummy vias and the device. The dummy vias are formed prior to the application of ball limiting metals or solder material. After placing the under ball materials and the solder materials, the material covering the dummy vias has an increased surface contact and thus provide improved robustness and lifetime of the solder connection. Structures of implementation of the method are provided with either completely or partially filled dummy vias.