| 摘要 |
An apparatus for pushing a semiconductor device is provided to avoid damage to a semiconductor device and return a pressurizing member to its initial position by precisely detecting the overload of a pressurizing member when a semiconductor device is received in a magazine or the semiconductor device received in the magazine is supplied to a resin molding part. A driving part(111) is installed in a support body(110). A base(120) is installed over the support body, sliding in a back-and-forth direction according to the operation of the driving part. A front block(130) is fixedly coupled to the upper surface of the base. A rear block(140) is installed in the rear surface of the front block, closely attached to the rear surface of the front block. A pressurizing member(150) pressurizes a semiconductor device, coupled to the rear block. A magnetism part is composed of a magnetic substance installed in the front block and a control screw installed in the rear block wherein the control screw is separated from the magnetic substance by an interval. The control screw controls the intensity of magnetism by which the front block is separated from the rear block. A leadframe on which a semiconductor device is placed can be received in a magazine.
|
