SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

A semiconductor device and a method for manufacturing the same are provided to reduce a manufacturing cost and to have high reliability. A method for manufacturing a semiconductor device comprises forming a bump(104) with a protrusion on an electrode pad(103), which is formed at a region corresponding to a semiconductor chip(101) of a substrate; forming an insulation layer(105) and a conductive layer on the substrate; pressurizing the conductive layer and rolling a front end of the protrusion exposed on the conductive layer; forming a conductive pattern(106) coupled to the bump by electrolytic plating; and rearranging the substrate.