| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a copper clad plate, reduced in the rate of dimensional change after etching while satisfying both dimensional change and heat resistance, having characteristics adaptable for AOI, also excellent in running property (slidability) and adhesiveness, and suitable for a high-performance flexible printed wiring board. <P>SOLUTION: The copper clad plate comprises: a polyimide film mainly including paraphenylenediamine and 4,4'-diaminodiphenyl ether as diamine component and pyromellitic acid dianhydride and 3,3',4,4'-biphenyltetracarboxylic dianhydride as acid dianhydride component, the film having slidability obtained by adding inorganic fine particles to generate surface projections thereon; a copper plate adhered to one surface of the polyimide film through an adhesive; and a copper plate adhered to the other surface of the film without adhesive. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
