发明名称 |
MANUFACTURING METHOD FOR OPTICAL SEMICONDUCTOR DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of simply manufacturing an optical semiconductor device superior in LED element protection property and durability by using an optical semiconductor element sealing sheet capable of sealing an optical semiconductor with a resin at once, and to provide the optical semiconductor element sealing sheet used in the manufacturing method. <P>SOLUTION: The optical semiconductor element sealing sheet is made by filling a resin sheet A with a plurality of resin layers B in discontinuous arrangement. This optical semiconductor element sealing sheet is used to oppose the resin layers B and a plurality of optical semiconductor elements mounted on a substrate to each other so that each element is buried in each resin layer B. The method for manufacturing the optical semiconductor and the optical semiconductor element sealing sheet for the manufacturing method concerned are also presented. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009060031(A) |
申请公布日期 |
2009.03.19 |
申请号 |
JP20070228002 |
申请日期 |
2007.09.03 |
申请人 |
NITTO DENKO CORP |
发明人 |
HARADA NORIAKI;KIMURA RYUICHI;AKAZAWA MITSUHARU |
分类号 |
H01L21/56;H01L23/29;H01L23/31;H01L33/48;H01S5/02 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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