发明名称 MANUFACTURING METHOD FOR OPTICAL SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of simply manufacturing an optical semiconductor device superior in LED element protection property and durability by using an optical semiconductor element sealing sheet capable of sealing an optical semiconductor with a resin at once, and to provide the optical semiconductor element sealing sheet used in the manufacturing method. <P>SOLUTION: The optical semiconductor element sealing sheet is made by filling a resin sheet A with a plurality of resin layers B in discontinuous arrangement. This optical semiconductor element sealing sheet is used to oppose the resin layers B and a plurality of optical semiconductor elements mounted on a substrate to each other so that each element is buried in each resin layer B. The method for manufacturing the optical semiconductor and the optical semiconductor element sealing sheet for the manufacturing method concerned are also presented. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009060031(A) 申请公布日期 2009.03.19
申请号 JP20070228002 申请日期 2007.09.03
申请人 NITTO DENKO CORP 发明人 HARADA NORIAKI;KIMURA RYUICHI;AKAZAWA MITSUHARU
分类号 H01L21/56;H01L23/29;H01L23/31;H01L33/48;H01S5/02 主分类号 H01L21/56
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