| 摘要 |
The present invention relates to bonding of optical elements such as an optical waveguide, an optical collimator, an optical attenuator, an optical isolator, etc., and in particular, to an apparatus and method for bonding the optical elements by non-contact soldering to prevent moisture from penetrate into inside the optical elements by performing soldering without being in direct contact with a bonding portion of optical elements and by sealing up completely a gap formed in the bonding portion between the housings during packaging or bonding optical elements. The apparatus for bonding optical elements comprising: at least two optical elements, an inside of which being provided with optical systems while an outside of which being surrounded by housings; alignment apparatus which fixes one end of the each optical element and aligns optical system of the optical elements; laser light sources disposed respectively at both end of the housings, illuminating the laser beams such that the beams are not focused on outer surface of the housings; lead-supplying units disposed respectively at both upper end of the laser light sources, supplying the lead on the laser beams; and a controller for controlling the laser light sources and the lead supplying units. |
