发明名称 METHODS OF FORMING CURVED IMAGE SENSORS
摘要 A method for forming curved image sensors may include applying positive pressure to the face of an image sensor, forcing the image sensor to adhere the curved surface of a substrate. The pressure may be applied to the face of the image sensor in a variety of ways, including using pneumatic pressure, hydraulic pressure, or pressure from an elastic or inelastic solid. Processing may occur on either a single image sensor die or an image sensor wafer. When an image sensor wafer is processed, a substrate may be used that has a number of cavities defined by respective curved surfaces with each cavity corresponding to a respective image sensor. When pressure is applied to the image sensor, the image sensor may deform until the curvature of the image sensor matches the curvature of the curved surface of the underlying substrate.
申请公布号 US2016286102(A1) 申请公布日期 2016.09.29
申请号 US201514667457 申请日期 2015.03.24
申请人 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC 发明人 SULFRIDGE Marc Allen;PERKINS Andrew Eugene;LAKE Rickie Charles;STERN Jonathan Michael
分类号 H04N5/225 主分类号 H04N5/225
代理机构 代理人
主权项 1. A method of forming a curved image sensor, the method comprising: applying adhesive to a curved surface of a substrate; positioning an image sensor above the curved surface of the substrate; and applying pressure to the image sensor so that the image sensor deforms and adheres to the curved surface.
地址 Phoenix AZ US