IR sensor package including a cover member and a sensor chip recessed into the package body

摘要

The infrared sensor includes: an infrared sensor chip in which a plurality of pixel portions each including a temperature-sensitive portion formed of a thermopile is disposed in an array on one surface side of a semiconductor substrate; and an IC chip that processes an output signal of the infrared sensor chip. A package includes a package main body on which the infrared sensor chip and the IC chip are mounted to be arranged side-by-side, and a package cover that has a lens transmitting infrared rays and is hermetically bonded to the package main body. The package is provided therein with a cover member that includes a window hole through which infrared rays pass into the infrared sensor chip and equalizes amounts of temperature change of hot junctions and cold junctions among the pixel portions, the temperature change resulting from heating of the IC chip.

主权项

1. An infrared sensor comprising:
an infrared sensor chip in which a plurality of pixel portions is disposed in an array on one surface side of a semiconductor substrate, each of said pixel portions including a temperature-sensitive portion formed of a thermopile; an IC chip configured to process an output signal of said infrared sensor chip; and a package in which said infrared sensor chip and said IC chip are accommodated, wherein said package includes: a package main body having a first region and a second region on which said infrared sensor chip and said IC chip are mounted, respectively, to be arranged side-by-side; and a package cover which is hermetically bonded to said package main body so as to surround said infrared sensor chip and said IC chip together with said package main body, said package cover having a function of transmitting infrared rays to be detected by said infrared sensor chip, said package is provided therein with a cover member which includes a hole through which infrared rays pass into said infrared sensor chip, said cover member equalizing, among the pixel portions, the amounts of temperature change of hot junctions and cold junctions caused by heating of said IC chip, said cover member is formed such that both said IC chip and said infrared sensor chip are included within a region of a circumferential line of said cover member in a thickness direction of the IC chip, and the second region is recessed into the package main body relative to the first region.