Integrated circuit having slot via and method of forming the same

摘要

An integrated circuit includes a first conductive line on a first metal level of the integrated circuit. The integrated circuit further includes a second conductive line on a second metal level of the integrated circuit. The integrated circuit further includes a slot via electrically connecting the first conductive line with the second conductive line. The slot via overlaps with the first conductive line and the second conductive line. The slot via extends beyond a periphery of at least one of the first conductive line or the second conductive line.

主权项

1. An integrated circuit on a substrate comprising:
a first conductive line on a first metal level of the integrated circuit, wherein the first conductive line extends in a first direction parallel a top surface of the substrate; a second conductive line on a second metal level of the integrated circuit above the first metal level, wherein the second conductive line extends in a second direction parallel the top surface of the substrate, the second direction perpendicular to the first direction; and a slot via having a length in the first direction and a width in the second direction, the length being greater than the width and electrically connecting the first conductive line with the second conductive line, wherein the slot via overlaps with the first conductive line and with the second conductive line, and the slot via extends beyond a periphery of the second conductive line, and wherein an entirety of the length of the slot via in the first direction interfaces with the first conductive line.