发明名称 Substrate support with wire mesh plasma containment
摘要 Embodiments of substrate supports having a wire mesh plasma containment are provided herein. In some embodiments, a substrate support may include a plate comprising a first surface, an opposing second surface, a thickness bounded by the first and second surfaces, and a first perimetrical surface; a first heater element disposed between the first and second surfaces; a wire mesh disposed between the first and second surfaces; a ground connector mounted to a surface of the plate; at least one electrical connection between the wire mesh and the ground connector; and an elongate shaft comprising a first end and an opposite second end, wherein the plate second surface is mounted to the first end of the shaft.
申请公布号 US9478447(B2) 申请公布日期 2016.10.25
申请号 US201213684672 申请日期 2012.11.26
申请人 APPLIED MATERIALS, INC. 发明人 Cuvalci Olkan;Tzu Gwo-Chuan
分类号 H05B3/06;H01L21/67;H05B3/28 主分类号 H05B3/06
代理机构 Moser Taboada 代理人 Moser Taboada ;Taboada Alan
主权项 1. A substrate support, comprising: a heater plate comprising a first surface, an opposing second surface, a thickness bounded by the first and second surfaces, and a first perimetrical surface; a first heater element disposed between the first and second surfaces; a wire mesh disposed between the first and second surfaces; a ground connector mounted to a surface of the heater plate; at least one electrical connection between the wire mesh and the ground connector; and an elongated shaft comprising a first end and an opposite second end, wherein the heater plate second surface is mounted to the first end of the shaft, wherein the ground connector comprises an annular ground plate.
地址 Santa Clara CA US