| 摘要 |
PURPOSE:To easily punch a protective film along the contour of a wafer by a method wherein the surface of the wafer is set at the level which is slightly higher than that of a protruding cutter and the protective film is attached to the surface of the wafer while the surface of the wafer is set at the level which is slightly lower than that of the cutter. CONSTITUTION:At the position of a shifting plate 1 as shown by a solid line, a semiconductor wafer is dropped into the limited space of a protruding cutter 2 at the shifting plate. Then, by supplying the air to a cylinder 7 in such a way that the shifting plate 1 is shifted to the position directly under guide rolls 12, 13 at a going-up-and-down stage 5 which is at the lifted position, its rod is pulled into the cylinder 7. At this moment, the air is supplied to a cylinder 17, and a piston 18 is lowered so that a wafer W can be lowered to the level where the surface of the wafer W is slightly lower than that of the cutter 2. Then, the air is supplied to a cylinder 8; a piston 9 is lowered; a protective film 16 is pressed to the cutter 2. After the protective film 16 has been punched along the periphery of the wafer W, the stage 5 is raised. Then, the air is blown to the cylinder 7 so that the rod can be shifted from the cylinder 7 to the stop end of the shifting plate 1. At the same time, a rack 14 is shifted in the direction which is opposite to the rod, and the punched part of the film is wound by a collection roller. |
